A Model of the Electro-Plating Process with Circuit Applications
Irina Mitrea
Master of Sciences (Industrial and Applied emphasis), June 2000
Abstract
The through-mask electro-plating phenomenon is governed by electro-chemical
equations with Butler-Volmer boundary conditions. This thesis provides a numerical
approach to solving the corresponding elliptic boundary value problem via the
classical method of layer potentials. More precisely, we devise a boundary element
method for a two dimensional model of the electro-plaint process when the domain
is a polygon in R squared. We present the numerical results
obtained and suggest future research directions.
Research supported by the Minnesota Center for Industrial
Mathematics (MCIM)
